TY  - JOUR
T1  - Automatic Heat Dispel System for DINGSON Biscuit Oven using Thermocouple Temperature
Sensor
AU - Jibril, Mustefa AU - Tesfaye, Hemen AU - Beyene, Tadele AU - Moges, Tsinukal 
JO  - Journal of Engineering and Applied Sciences
VL  - 16
IS  - 4
SP  - 147
EP  - 151
PY  - 2021
DA  - 2001/08/19
SN  - 1816-949x
DO  - jeasci.2021.147.151
UR  - https://makhillpublications.co/view-article.php?doi=jeasci.2021.147.151
KW  - DINGSON
KW  -oven
KW  -thermocouple
KW  -dispel
AB  - In this study, an automatic heat dispel system
for DINGSON Biscuit Oven have been designed and
simulated using Proteus program successfully. This
system uses thermocouple temperature sensor to sense the
oven temperature and automatically open and close the
dispel system. The temperature in which the dispel open
and close can be adjusted any time the operator needs to
adjust it.
ER  -