TY  - JOUR
T1  - Examination of Interfacial Compatibility Within WPC Panels
Using Electrical Impedance Spectroscopy
AU - Lazrak, Charaf AU - Famiri, Abderrahim AU - Ziani, Mohsine AU - Hammi, Maryama AU - Hakam, Abdelillah 
JO  - Journal of Engineering and Applied Sciences
VL  - 13
IS  - 9
SP  - 2786
EP  - 2790
PY  - 2018
DA  - 2001/08/19
SN  - 1816-949x
DO  - jeasci.2018.2786.2790
UR  - https://makhillpublications.co/view-article.php?doi=jeasci.2018.2786.2790
KW  - electrical impedance spectroscopy
KW  -interfacial compatibility
KW  -polyethylene
KW  -Composite
KW  -double-DCE
KW  -relaxation time
AB  - Composite plates containing pine wood particulates and high density Polyethylene (PE) matrix were
prepared using thermo-compression and characterized by Electrical Impedance Spectroscopy (EIS)
measurements at room temperature and under frequency interval of 40-100 kHz for different wood contents
ranging from 40-70%. The double-DCE (ZARC) Model was used as equivalent circuit for the obtained plates.
The impedance parameters of this model such as intracellular Resistance (R<sub>i</sub>), extracellular Resistances (R<sub>e1</sub> and i 
R<sub>e2</sub> ), relaxation time (&tau;<sub>1</sub> and &tau;<sub>2</sub> ) and the distributed coefficient of the relaxation time (&Psi;<sub>1</sub> and &Psi;<sub>2</sub> ) were determined
for the different specimens. Effects of pine powder concentration on interfacial compatibility within the
composites were analyzed. The relaxation time increased with increasing wood contents up to 50% and
decreased at higher rates. This finding suggests that the optimal interfacial compatibility in wood
powder/polyethylene chips composites without additives is attributed at 50% wood contents.
ER  -