@article{MAKHILLJEAS201813916099,
    title = {Examination of Interfacial Compatibility Within WPC Panels
Using Electrical Impedance Spectroscopy},
    journal = {Journal of Engineering and Applied Sciences},
    volume = {13},
    number = {9},
    pages = {2786-2790},
    year = {2018},
    issn = {1816-949x},
    doi = {jeasci.2018.2786.2790},
    url = {https://makhillpublications.co/view-article.php?issn=1816-949x&doi=jeasci.2018.2786.2790},
    author = {Charaf,Abderrahim,Mohsine,Maryama and},
    keywords = {electrical impedance spectroscopy,interfacial compatibility,polyethylene,Composite,double-DCE,relaxation time},
    abstract = {Composite plates containing pine wood particulates and high density Polyethylene (PE) matrix were
prepared using thermo-compression and characterized by Electrical Impedance Spectroscopy (EIS)
measurements at room temperature and under frequency interval of 40-100 kHz for different wood contents
ranging from 40-70%. The double-DCE (ZARC) Model was used as equivalent circuit for the obtained plates.
The impedance parameters of this model such as intracellular Resistance (R<sub>i</sub>), extracellular Resistances (R<sub>e1</sub> and i 
R<sub>e2</sub> ), relaxation time (&tau;<sub>1</sub> and &tau;<sub>2</sub> ) and the distributed coefficient of the relaxation time (&Psi;<sub>1</sub> and &Psi;<sub>2</sub> ) were determined
for the different specimens. Effects of pine powder concentration on interfacial compatibility within the
composites were analyzed. The relaxation time increased with increasing wood contents up to 50% and
decreased at higher rates. This finding suggests that the optimal interfacial compatibility in wood
powder/polyethylene chips composites without additives is attributed at 50% wood contents.}
    }